The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Aug. 15, 2013
Applicant:

Apple Inc., Cupertino, CA (US);

Inventors:

Joshua G. Nickel, San Jose, CA (US);

Chun-Lung Chen, Sunnyvale, CA (US);

Tseng-Mau Yang, Kitchener, CA;

Nicholas G. Merz, San Francisco, CA (US);

Robert W. Schlub, Cupertino, CA (US);

Boon W. Shiu, San Jose, CA (US);

Erica J. Tong, Pacifica, CA (US);

Assignee:

Apple Inc., Cupertino, CA (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01N 19/04 (2006.01); G01N 3/56 (2006.01); H04B 17/00 (2015.01); G01N 3/08 (2006.01); G01N 3/24 (2006.01); H04B 17/16 (2015.01);
U.S. Cl.
CPC ...
G01N 3/56 (2013.01); G01N 3/08 (2013.01); G01N 3/24 (2013.01); G01N 19/04 (2013.01); H04B 17/00 (2013.01); H04B 17/16 (2015.01);
Abstract

Damage to conductive material that serves as bridging connections between conductive structures within an electronic device may result in deficiencies in radio-frequency (RF) and other wireless communications. A test system for testing device structures under test is provided. Device structures under test may include substrates and a conductive material between the substrates. The test system may include a test fixture for increasing tensile or compressive stress on the device structures under test to evaluate the resilience of the conductive material. The test system may also include a test unit for transmitting RF test signals and receiving test data from the device structures under test. The received test data may include scattered parameter measurements from the device structures under test that may be used to determine if the device structures under test meet desired RF performance criteria.


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