The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Apr. 28, 2011
Applicants:

Swetha Chandra, Bangalore, IN;

Sudip Mondal, Bangalore, IN;

Venkataraman Venkatakrishnan, Karnataka, IN;

Sathyadeep Viswanathan, Karnataka, IN;

Renjith Mahiladevi Radhakrishnan, Karnataka, IN;

Raviprakash Jayaraman, Karnataka, IN;

Chandrasekhar Bhaskaran Nair, Karnataka, IN;

Pillarisetti Venkata Subbarao, Karnataka, IN;

Inventors:

Swetha Chandra, Bangalore, IN;

Sudip Mondal, Bangalore, IN;

Venkataraman Venkatakrishnan, Karnataka, IN;

Sathyadeep Viswanathan, Karnataka, IN;

Renjith Mahiladevi Radhakrishnan, Karnataka, IN;

Raviprakash Jayaraman, Karnataka, IN;

Chandrasekhar Bhaskaran Nair, Karnataka, IN;

Pillarisetti Venkata Subbarao, Karnataka, IN;

Assignee:

BIGTEC PRIVATE LIMITED, Rajajinagar, Bangalore, IN;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C12Q 1/68 (2006.01); B01L 7/00 (2006.01); C12Q 3/00 (2006.01);
U.S. Cl.
CPC ...
C12Q 1/686 (2013.01); B01L 7/52 (2013.01); C12Q 3/00 (2013.01); B01L 2200/027 (2013.01); B01L 2200/0684 (2013.01); B01L 2200/147 (2013.01); B01L 2300/0816 (2013.01); B01L 2300/0887 (2013.01); B01L 2300/12 (2013.01); B01L 2300/1816 (2013.01);
Abstract

The present disclosure provides a non-contact real time micro Polymerase Chain Reaction (PCR) system comprising; a chip having a reaction chamber for holding a sample and an embedded metal heater below the reaction chamber for heating the sample; an optical unit comprising an associated LED driver and a photo detector amplifier placed above the chip to detect fluorescence; an induction heater mounted around the chip and inductively coupled to the metal heater; an infrared temperature sensor mounted below the chip for measuring a temperature of the metal heater, wherein the infrared temperature sensor is interfaced with a signal conditioner; and a controller interfaced with the signal conditioner and the induction heater for regulating the power to the induction heater based on feedback received from the infrared temperature sensor through the signal conditioner.


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