The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Sep. 23, 2011
Applicants:

Simon Sutton, Egham, GB;

Theo E. Geussens, Samstagern, CH;

Alun Vaughan, Winchester, GB;

Gary Stevens, Surrey, GB;

Inventors:

Simon Sutton, Egham, GB;

Theo E. Geussens, Samstagern, CH;

Alun Vaughan, Winchester, GB;

Gary Stevens, Surrey, GB;

Assignees:

Dow Global Technologies LLC, Midland, MI (US);

Dow Chemical Company Limited, Middlesex, GB;

University of Southampton, Southampton, GB;

GnoSys Global Ltd., Surrey, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 123/06 (2006.01); C08L 23/06 (2006.01); H01B 3/30 (2006.01);
U.S. Cl.
CPC ...
C09D 123/06 (2013.01); C08L 23/06 (2013.01); H01B 3/307 (2013.01); C08L 2205/02 (2013.01);
Abstract

The disclosure provides a process for producing a material with improved breakdown strength. The process includes heating a polymeric composition composed of a low density polyethylene (LDPE) and a minority amount of a high density polyethylene (HDPE). The polymeric composition is heated to at least the melting temperature of the HDPE. The process includes control-cooling the heated polymeric composition at a cooling rate from 0.1° C./min to 20° C./min, and forming a polymeric composition. The control-cooled polymeric composition has a unique morphology which improves breakdown strength. Also provided is a coated conductor with an insulating layer composed of the polymeric composition with the unique morphology. The insulating layer exhibits improved breakdown strength.


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