The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Jun. 05, 2015
Applicant:

Elite Material Co., Ltd., Taoyuan, TW;

Inventor:

Chen Yu Hsieh, Taoyuan, TW;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08L 7/02 (2006.01); C08L 77/06 (2006.01); H05K 1/03 (2006.01); C08G 73/10 (2006.01); C08L 79/08 (2006.01);
U.S. Cl.
CPC ...
C08L 77/06 (2013.01); C08G 73/105 (2013.01); C08G 73/1014 (2013.01); C08G 73/1017 (2013.01); C08G 73/1042 (2013.01); C08G 73/1046 (2013.01); C08G 73/1082 (2013.01); C08L 79/08 (2013.01); H05K 1/0353 (2013.01); C08L 2201/02 (2013.01); C08L 2203/20 (2013.01); C08L 2205/03 (2013.01); H05K 2201/012 (2013.01); H05K 2201/0154 (2013.01); H05K 2201/0358 (2013.01);
Abstract

A resin composition, including (A) a polyimide resin; (B) a pre-polymerized maleimide resin; (C) a thermosetting resin; and (D) a flame retardant. The reactants for use in synthesizing the polyimide resin include an acid anhydride and a diamine, with the diamine including 4,4'-diaminodiphenylmethane and its analogous compounds and polyetherdiamines. The resin composition has the following advantages, a resin film or a prepreg is manufactured from the resin composition comprises a polyimide resin synthesized from a diamine of a specific structure and a pre-polymerized maleimide resin, so as to achieve satisfactory characteristics of circuit laminates, such as a low dielectric constant, a low dissipation factor, high heat resistance, and high adhesiveness, so as to be for use in the manufacturing of metal clad laminates and printed circuit boards.


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