The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Mar. 30, 2007
Applicants:

Hiroshi Uehara, Chiba, JP;

Mariko Harigaya, Utsunomiya, JP;

Masayoshi Yamaguchi, Chiba, JP;

Inventors:

Hiroshi Uehara, Chiba, JP;

Mariko Harigaya, Utsunomiya, JP;

Masayoshi Yamaguchi, Chiba, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01B 17/00 (2006.01); C08L 51/00 (2006.01); C08K 3/22 (2006.01); C08L 51/06 (2006.01); C08F 255/02 (2006.01); C08L 23/10 (2006.01); H01B 3/44 (2006.01);
U.S. Cl.
CPC ...
C08L 51/06 (2013.01); C08F 255/02 (2013.01); C08L 23/10 (2013.01); H01B 3/441 (2013.01); C08L 2205/02 (2013.01);
Abstract

Propylene-based resin compositions contain an inorganic filler in a high ratio and are excellent in flexibility, mechanical strength, elongation at break, heat resistance, scratch resistance, whitening resistance and flame retardancy. Shaped articles comprise the compositions. A first propylene-based resin composition of the present invention contains 5 to 64.9% by weight of a propylene-based polymer (A) having a melting point, as measured by differential scanning calorimetry (DSC), in the range of 120° C. to 170° C.; 0 to 59.9% by weight of a propylene-based polymer (B) having a melting point, as measured by differential scanning calorimetry (DSC), of less than 120° C. or having no observed melting point; 0.1 to 30% by weight of a graft-modified propylene-based polymer (C) obtained by graft modifying a propylene-based polymer having a melting point, as measured by differential scanning calorimetry (DSC), of less than 120° C. or having no observed melting point; and 35 to 75% by weight of an inorganic filler (D) (here, the total amount of (A), (B), (C) and (D) is 100% by weight).


Find Patent Forward Citations

Loading…