The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Aug. 24, 2012
Kenichiro Hiwatari, Tokyo, JP;
Atsuo Tomita, Tokyo, JP;
Tomoaki Saiki, Tokyo, JP;
Kiyoshi Murata, Tokyo, JP;
Kenichiro Hiwatari, Tokyo, JP;
Atsuo Tomita, Tokyo, JP;
Tomoaki Saiki, Tokyo, JP;
Kiyoshi Murata, Tokyo, JP;
ADEKA CORPORATION, Tokyo, JP;
Abstract
Provided are: a curable composition from which a cured article having excellent molding processability and high heat resistance as well as such a high Tg that it can be used as a molding resin for a SiC power semiconductor can be obtained; and a cured article thereof. The curable composition comprises: 100 parts by mass of a compound having at least two partial structures represented by the following Formula (1) in the molecule as a component (A); 0.5 to 3 parts by mass of a thermal radical generator as a component (B); and 0 to 50 parts by mass of other radical-reactive compound as a component (C):