The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2016
Filed:
Aug. 15, 2014
Sumco Corporation, Tokyo, JP;
Tomonori Miura, Saga, JP;
Hiroto Fukushima, Saga, JP;
SUMCO CORPORATION, Tokyo, JP;
Abstract
A double-side polishing apparatus for a work according to the present invention includes one or more work thickness measuring devices and a control unit. The double-side polishing method for a work includes the steps of: first polishing for polishing both surfaces of the work; first measurement for measuring the thickness of the work; in the first measurement step, when the thickness of the work is found to reach the predetermined thickness, terminating the orbital motion of the carrier plate; second polishing both surfaces of the work while the carrier plate performs only rotational motion; second measurement for measuring the thickness of the work at predetermined position(s); and determining a time for terminating polishing based on the result of the measurement of the thickness of the work in the second measurement step.