The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 02, 2016

Filed:

Sep. 02, 2014
Applicant:

Dainippon Screen Mfg. Co., Ltd., Kyoto, JP;

Inventors:

Sei Negoro, Kyoto, JP;

Ryo Muramoto, Kyoto, JP;

Yasuhiko Nagai, Kyoto, JP;

Tsutomu Osuka, Kyoto, JP;

Keiji Iwata, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B44C 1/22 (2006.01); B05D 3/10 (2006.01); B05D 1/36 (2006.01); H01L 21/67 (2006.01);
U.S. Cl.
CPC ...
B05D 3/105 (2013.01); B05D 1/36 (2013.01); H01L 21/67028 (2013.01); H01L 21/67051 (2013.01);
Abstract

A substrate processing method includes an SPM supplying step of supplying SPM having high temperature to an upper surface of a substrate, a DIW supplying step of supplying, after the SPM supplying step, DIW having room temperature to the upper surface of the substrate to rinse off the liquid remaining on the substrate, a hydrogen peroxide water supplying step of supplying, after the SPM supplying step and before the DIW supplying step, hydrogen peroxide water of a liquid temperature lower than the temperature of the SPM and not less than room temperature, to the upper surface of the substrate in a state where the SPM remains on the substrate, and a temperature decrease suppressing step of supplying, in parallel to the hydrogen peroxide water supplying step, pure water having high temperature to a lower surface of the substrate.


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