The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Oct. 10, 2014
Applicant:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Inventors:

David Auchere, St. Martin d'Heres, FR;

Yvon Imbs, Quaix en Chartreuse, FR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/11 (2006.01); H05K 7/20 (2006.01); H05K 1/14 (2006.01); H01L 23/473 (2006.01); H01L 23/498 (2006.01); H01L 25/10 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20 (2013.01); H01L 23/473 (2013.01); H01L 23/49816 (2013.01); H01L 25/105 (2013.01); H05K 1/0201 (2013.01); H05K 1/0203 (2013.01); H05K 1/111 (2013.01); H05K 1/14 (2013.01); H05K 1/181 (2013.01); H01L 2224/73204 (2013.01); H05K 2201/064 (2013.01);
Abstract

An electronic device includes a substrate wafer made of an insulating material and having an electrical connection network. An integrated circuit chip is mounted to a top side of the substrate wafer. The substrate wafer contains an internal duct. The duct is formed by a covered trench located in the top side of the substrate wafer. The trench contains a thermally conductive material, for example being a fluid. Openings in the top side of the substrate wafer that are offset from the trench permit the making of an electrical connection between the integrated circuit and the electrical connection network.


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