The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Apr. 24, 2015
Applicant:
Apple Inc., Cupertino, CA (US);
Inventors:
Shawn X. Arnold, Santa Cruz, CA (US);
Terry L. Gilton, Boise, ID (US);
Matthew E. Last, Santa Clara, CA (US);
Assignee:
Apple Inc., Cupertino, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05K 1/18 (2006.01); H01L 29/06 (2006.01); G06K 9/00 (2006.01); H01L 23/00 (2006.01); G06F 1/16 (2006.01); G06F 3/041 (2006.01); H05K 1/11 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
H05K 1/183 (2013.01); G06F 1/16 (2013.01); G06F 3/041 (2013.01); G06K 9/00053 (2013.01); H01L 24/11 (2013.01); H01L 24/43 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 29/0657 (2013.01); H05K 1/111 (2013.01); H01L 23/24 (2013.01); H01L 24/45 (2013.01); H01L 2224/43 (2013.01); H01L 2224/451 (2013.01); H01L 2224/45015 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/85 (2013.01); H01L 2924/00 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/10155 (2013.01); H01L 2924/10253 (2013.01); H05K 2201/09036 (2013.01); H05K 2201/10151 (2013.01);
Abstract
Various methods for forming a low profile assembly are described. The low profile assembly may include an integrated circuit. The integrated circuit as well as components associated with the integrated circuit may be positioned below a surface plane of a printed circuit board in which the integrated circuit is located. The integrated circuit may include bond wires configured to electrically connect the integrated circuits to other components. The low profile assembly may include forming various layers over a substrate and later removing some of the layers.