The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Oct. 25, 2013
Applicant:
Nsk Ltd., Shinagawa-ku, Tokyo, JP;
Inventors:
Assignee:
NSK Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/00 (2006.01); H05K 1/09 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 23/373 (2006.01); H01L 23/498 (2006.01); H01L 23/495 (2006.01); H05K 1/02 (2006.01); H05K 1/05 (2006.01); H05K 1/18 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H05K 1/09 (2013.01); H01L 23/3735 (2013.01); H01L 23/49582 (2013.01); H01L 23/49811 (2013.01); H01L 24/35 (2013.01); H01L 24/37 (2013.01); H01L 24/41 (2013.01); H01L 24/83 (2013.01); H01L 24/84 (2013.01); H01L 24/92 (2013.01); H01L 25/07 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H05K 1/0271 (2013.01); H05K 1/05 (2013.01); H05K 1/181 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/40 (2013.01); H01L 24/73 (2013.01); H01L 2224/05553 (2013.01); H01L 2224/0603 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/32238 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/352 (2013.01); H01L 2224/35847 (2013.01); H01L 2224/3701 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/37147 (2013.01); H01L 2224/40095 (2013.01); H01L 2224/40225 (2013.01); H01L 2224/40227 (2013.01); H01L 2224/40475 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/4103 (2013.01); H01L 2224/4112 (2013.01); H01L 2224/48 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/77272 (2013.01); H01L 2224/8321 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83424 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83815 (2013.01); H01L 2224/84424 (2013.01); H01L 2224/84447 (2013.01); H01L 2224/84815 (2013.01); H01L 2224/85 (2013.01); H01L 2224/9221 (2013.01); H01L 2924/014 (2013.01); H01L 2924/1305 (2013.01); H01L 2924/1306 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3011 (2013.01); H01L 2924/351 (2013.01); H05K 2201/10166 (2013.01);
Abstract
A semiconductor module includes a copper connector jointing an electrode formed on a top surface of a bare-chip transistor and a wiring pattern out of plural wiring patterns via a solder. The copper connector includes an electrode jointing portion jointed to the electrode of the bare-chip transistor and a substrate jointing portion arranged to face the electrode-jointing portion and jointed to the wiring pattern. The width Wof the electrode jointing portion in a direction perpendicular to one direction is smaller than the width Wof the substrate jointing portion in the direction perpendicular to the one direction.