The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Jan. 09, 2014
Applicant:

Nsk Ltd., Shinagawa-ku, Tokyo, JP;

Inventors:

Naoto Shinkawa, Tokyo, JP;

Shigeru Fukinuki, Tokyo, JP;

Assignee:

NSK Ltd., Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 1/11 (2006.01); H05K 1/16 (2006.01); B62D 5/04 (2006.01); H05K 1/14 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0231 (2013.01); B62D 5/0406 (2013.01); H05K 1/0233 (2013.01); H05K 1/0298 (2013.01); H05K 1/115 (2013.01); H05K 1/162 (2013.01); H01L 2224/4103 (2013.01); H05K 1/141 (2013.01); H05K 1/18 (2013.01); H05K 2201/042 (2013.01); H05K 2201/097 (2013.01); H05K 2201/1006 (2013.01);
Abstract

There is provided a printed circuit substrate and a noise suppression structure capable of minimizing constraint on a component layout on a substrate and suppressing noise. The printed circuit substrate includes conductive patterns of odd numbered layers and conductive patterns of even numbered layers which are alternately arranged in a vertical direction and hold an insulating layer between each layer. Portions excepting predetermined areas for connecting a first through-hole and predetermined areas for insulating from a second through-hole in the conductive patterns of the odd numbered layers have a same shape as portions excepting predetermined areas for connecting the second through-hole and predetermined areas for insulating the first through-hole in the conductive patterns of the even numbered layers, and the portions are laminated on one another at the same position in the vertical direction.


Find Patent Forward Citations

Loading…