The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Apr. 02, 2014
Applicant:
Panasonic Corporation, Osaka, JP;
Inventor:
Daisuke Matsuoka, Osaka, JP;
Assignee:
SOCIONEXT INC., Kanagawa, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H02H 3/22 (2006.01); H02H 9/04 (2006.01); H01L 23/522 (2006.01); H01L 27/06 (2006.01); H01L 27/02 (2006.01); H02H 3/20 (2006.01); H03K 19/00 (2006.01);
U.S. Cl.
CPC ...
H02H 9/041 (2013.01); H01L 23/5223 (2013.01); H01L 27/0285 (2013.01); H01L 27/0629 (2013.01); H01L 27/0676 (2013.01); H01L 2924/0002 (2013.01); H02H 3/20 (2013.01); H02H 9/046 (2013.01); H03K 19/0013 (2013.01);
Abstract
An ESD protection circuit includes a resistive element, a capacitive element, a protecting element, and a controller. The resistive element, the protecting element, and the controller are provided in an element formation layer. At least part of the capacitive element includes an interconnect capacitor provided in a plurality of interconnect layers. When viewed in plan, at least part of a capacitance formation region in which the interconnect capacitor is provided overlaps at least part of an element formation region in which the resistive element, the protecting element, and the controller are provided.