The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Jan. 06, 2015
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventors:

Jonghwan Lee, Yongin, KR;

Taehwan Kim, Yongin, KR;

Boram Lee, Yongin, KR;

Sangil Kim, Yongin, KR;

Jongseong Kim, Yongin, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 51/00 (2006.01); H01L 27/32 (2006.01); G06F 3/044 (2006.01); G06F 3/041 (2006.01); G02F 1/1333 (2006.01);
U.S. Cl.
CPC ...
H01L 51/0024 (2013.01); G06F 3/044 (2013.01); G06F 3/0412 (2013.01); H01L 27/323 (2013.01); H01L 51/003 (2013.01); G02F 1/1333 (2013.01); G02F 1/13338 (2013.01); G06F 2203/04103 (2013.01);
Abstract

A method of manufacturing a display apparatus includes: joining a first thin-film glass substrate onto a first carrier substrate; providing a touch pattern unit on a surface of the first thin-film glass substrate, which is opposite to a surface facing the first carrier substrate; separating the first thin-film glass substrate from the first carrier substrate; turning over the first thin-film glass substrate and joining the turned over first thin-film glass substrate onto the first carrier substrate; joining a second thin-film glass substrate onto a second carrier substrate; providing a display unit between the surface of the first thin-film glass substrate opposite to the surface on which the touch pattern unit is provided and a surface of the second thin-film glass substrate, which is opposite to a surface facing the second carrier substrate; and removing the first carrier substrate and the second carrier substrate.


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