The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Jan. 07, 2015
Applicant:

Sae Magnetics (H.k.) Ltd., Hong Kong, CN;

Inventors:

Wei Xiong, Hong Kong, CN;

Takao Noguchi, Hong Kong, CN;

Daisuke Iitsuka, Hong Kong, CN;

Assignee:

SAE MAGNETICS (H.K.) LTD., Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/55 (2006.01); H01L 41/083 (2006.01); H01L 41/053 (2006.01); H01L 41/08 (2006.01); B41J 2/14 (2006.01); H01L 41/113 (2006.01); G02B 3/14 (2006.01); G02B 7/04 (2006.01);
U.S. Cl.
CPC ...
H01L 41/0536 (2013.01); B41J 2/14 (2013.01); B41J 2/14233 (2013.01); G02B 3/14 (2013.01); G02B 7/04 (2013.01); G11B 5/483 (2015.09); G11B 5/5552 (2013.01); H01L 41/0805 (2013.01); H01L 41/0815 (2013.01); H01L 41/0831 (2013.01); H01L 41/1132 (2013.01);
Abstract

A thin-film piezoelectric material element includes a lower electrode film, a piezoelectric material film, and an upper electrode film, the lower electrode film, the piezoelectric material film and the upper electrode film are laminated sequentially. An upper surface of the piezoelectric material film is a concavity and convexity surface having a convex part and a concave part, the convex part is a curved surface convexly projected, and the concave part is a curved surface concavely hollowed, the upper electrode film is formed on the concavity and convexity surface. The thin-film piezoelectric material element has a stress balancing film formed with a material having an internal stress capable of cancelling an element stress, the stress balancing film is formed on the upper electrode film.


Find Patent Forward Citations

Loading…