The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Apr. 27, 2010
Applicant:

Kyoung Woo JO, Gunpo-si, KR;

Inventor:

Kyoung Woo Jo, Gunpo-si, KR;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/64 (2010.01); H01L 33/20 (2010.01); H01L 33/48 (2010.01);
U.S. Cl.
CPC ...
H01L 33/64 (2013.01); H01L 33/20 (2013.01); H01L 33/486 (2013.01); H01L 33/647 (2013.01); H01L 33/642 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/10158 (2013.01);
Abstract

Provided are a light emitting device (LED) package and a lighting system including the same. The LED package comprises a package body comprising a recess in an upper portion thereof, and an LED chip provided in the recess of the package body. The LED package has a structure in which the LED chip may be buried into a recess formed on a planar surface on the upper portion of the package body such that a bottom surface of the recess lies below the planar surface. Thus, a main path through which heat generated from the LED chip is transmitted may be expanded from a bottom surface of the LED chip up to a lateral surface thereof to widen a dissipation area, thereby improving thermal emission efficiency.


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