The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9401431 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 26, 2016

Filed:

Feb. 06, 2012
Applicants:

Chan-long Shieh, Paradise Valley, AZ (US);

Gang Yu, Santa Barbara, CA (US);

Inventors:

Chan-Long Shieh, Paradise Valley, AZ (US);

Gang Yu, Santa Barbara, CA (US);

Assignee:

CBRITE INC., Goleta, CA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/04 (2006.01); H01L 21/02 (2006.01); H01L 27/12 (2006.01); H01L 29/786 (2006.01); H01L 29/66 (2006.01); H01L 29/45 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7869 (2013.01); H01L 27/1225 (2013.01); H01L 27/1259 (2013.01); H01L 29/45 (2013.01); H01L 29/66969 (2013.01); H01L 29/78606 (2013.01); H01L 21/02554 (2013.01); H01L 21/02565 (2013.01);
Abstract

A method of fabricating metal oxide TFTs on transparent substrates includes the steps of positioning an opaque gate metal area on the front surface of the substrate, depositing transparent gate dielectric and transparent metal oxide semiconductor layers overlying the gate metal and a surrounding area, depositing transparent passivation material on the semiconductor material, depositing photoresist on the passivation material, exposing and developing the photoresist to remove exposed portions, etching the passivation material to leave a passivation area defining a channel area, depositing transparent conductive material over the passivation area, depositing photoresist over the conductive material, exposing and developing the photoresist to remove unexposed portions, and etching the conductive material to leave source and drain areas on opposed sides of the channel area.


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