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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9401349 B1

PDFFull Text
Date of Patent:
Jul. 26, 2016

Filed:

May. 28, 2015

Stack of integrated-circuit chips and electronic device

Applicants:

Stmicroelectronics (Grenoble 2) Sas, Grenoble, FR;

Stmicroelectronics (Malta) Ltd, Kirkop, MT;

Stmicroelectronics S.r.l., Agrate Brianza, IT;

Inventors:

Angelo Crobu, San Donato Milanese, IT;

Kenneth Fonk, San Gwann, MT;

Romain Coffy, Voiron, FR;

Assignees:

STMICROELECTRONICS (GRENOBLE 2) SAS, Grenoble, FR;

STMICROELECTRONICS (MALTA) LTD, Kirkop, MT;

STMICROELECTRONICS S.R.L., Agrate Brianza, IT;

Attorney:

Gardere Wynne Sewell LLP

Primary Examiner:

Victor A Mandala

Int. Cl.
CPC ...
G01P 15/08 (2006.01); H01L 25/18 (2006.01); G01L 19/14 (2006.01); H01L 23/24 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); G01L 19/147 (2013.01); G01L 19/148 (2013.01); H01L 23/24 (2013.01); H01L 23/3157 (2013.01); H01L 24/10 (2013.01); H01L 24/33 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 25/0657 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/10135 (2013.01); H01L 2224/10165 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/26122 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/33181 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48145 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/73207 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06506 (2013.01); H01L 2225/06568 (2013.01); H01L 2225/06575 (2013.01); H01L 2924/14 (2013.01); H01L 2924/146 (2013.01); H01L 2924/16151 (2013.01);
Abstract

A stack of chips is formed by a first integrated-circuit chip and a second integrated-circuit chip. The chips have opposing faces which are separated from each other by an interposed spacer. The spacer is fastened by adhesion to only one of the opposing faces. The opposing faces are fastened to each other by a local adhesive which is separate from spacer.

Find Patent Forward Citations

Quick Actions:

Crobu, Angelo. (2016). Stack of integrated-circuit chips and electronic device (U.S. Patent No. 9401349). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9401349

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