The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Jun. 11, 2015
Applicant:

Globalfoundries Inc., Grand Cayman, KY (US);

Inventors:

Sukeshwar Kannan, Malta, NY (US);

Kaushal Kannan, Auburn, AL (US);

Assignee:

GLOBALFOUNDRIES INC., Grand Cayman, KY;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H03K 19/177 (2006.01); H03K 19/173 (2006.01); H01L 21/66 (2006.01);
U.S. Cl.
CPC ...
H01L 22/12 (2013.01); H01L 21/76898 (2013.01); H03K 19/1735 (2013.01); H03K 19/17736 (2013.01); H03K 19/17764 (2013.01);
Abstract

A method of redirecting signal bits associated with or corresponding to defective TSVs of a TSV array to a row or a column of redundant TSVs in the TSV array using a 2:4 Decoder and 4:2 Encoder and the resulting device are provided. Embodiments include forming a TSV array between a bottom die and a top die of a 3D IC stack, the TSV array having a row and a column of redundant TSVs; identifying a defective TSV of the TSV array; determining whether to shift a signal bit associated with or corresponding to the defective TSV in a first and/or a second direction towards the row or the column of redundant TSVs; and shifting the signal bit in the first and/or the second direction until the signal bit has been redirected to the row or the column of redundant TSVs.


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