The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Sep. 03, 2014
Applicant:
Sandisk Technologies Inc., Plano, TX (US);
Inventors:
Keita Akasaki, Yokkaichi, JP;
Hirotada Tobita, Yokkaichi, JP;
Assignee:
SanDisk Technologies LLC, Plano, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/3205 (2006.01); H01L 21/4763 (2006.01); H01L 21/033 (2006.01); H01L 21/768 (2006.01); H01L 27/115 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/0332 (2013.01); H01L 21/0338 (2013.01); H01L 21/3081 (2013.01); H01L 21/3088 (2013.01); H01L 21/76832 (2013.01); H01L 21/76856 (2013.01); H01L 21/76885 (2013.01); H01L 27/115 (2013.01); H01L 27/11517 (2013.01); H01L 27/11524 (2013.01);
Abstract
Word lines are formed from a stack of layers that includes a metal (e.g. tungsten) layer with an overlying multi-layer cap structure. The multi-layer cap structure includes a layer with a low etch rate to protect metal from damage during anisotropic etching. The multi-layer cap structure includes a layer with stress (e.g. tensile) that is opposite to the stress of the metal (e.g. compressive) to provide low combined stress.