The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Dec. 15, 2014
Applicant:

Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-fu, JP;

Inventors:

Toshihiro Suzuki, Nagaokakyo, JP;

Naoaki Ogata, Nagaokakyo, JP;

Masahito Ishikawa, Nagaokakyo, JP;

Assignee:

MURATA MANUFACTURING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01B 1/22 (2006.01); B05D 5/12 (2006.01); H01G 4/30 (2006.01); C09D 11/037 (2014.01); C09D 11/106 (2014.01); C09D 11/52 (2014.01); C09D 5/24 (2006.01); H01G 2/06 (2006.01); H01G 4/012 (2006.01); H01G 4/248 (2006.01); H01G 4/008 (2006.01); H01G 4/232 (2006.01); H05K 1/09 (2006.01); H05K 3/46 (2006.01); H01G 4/12 (2006.01);
U.S. Cl.
CPC ...
H01G 4/30 (2013.01); C09D 5/24 (2013.01); C09D 11/037 (2013.01); C09D 11/106 (2013.01); C09D 11/52 (2013.01); H01B 1/22 (2013.01); H01G 2/06 (2013.01); H01G 4/0085 (2013.01); H01G 4/012 (2013.01); H01G 4/232 (2013.01); H01G 4/248 (2013.01); H01G 4/12 (2013.01); H05K 1/092 (2013.01); H05K 3/4605 (2013.01); Y10T 29/43 (2015.01);
Abstract

A conductive paste that includes a (meth)acrylic resin serving as a binder resin, an organic solvent, and a metal powder. The (meth)acrylic resin has a glass transition point Tg in the range of −60° C. to 120° C., a hydroxyl group content in the range of 0.01% to 5% by weight per molecule, an acid value in the range of 1 to 50 mgKOH/g, and a weight-average molecular weight in the range of 10,000 to 350,000 Mw.


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