The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 26, 2016

Filed:

Apr. 26, 2012
Applicants:

Yuji Yamamoto, Osaka, JP;

Toshihiko Wada, Osaka, JP;

Yoshifumi Takasu, Osaka, JP;

Akihisa Yamada, Osaka, JP;

Inventors:

Yuji Yamamoto, Osaka, JP;

Toshihiko Wada, Osaka, JP;

Yoshifumi Takasu, Osaka, JP;

Akihisa Yamada, Osaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B29C 59/02 (2006.01); G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); B29C 33/42 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 59/02 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01); B29C 33/42 (2013.01);
Abstract

The present invention is a method of manufacturing a fine structure body which manufactures the fine structure body by repeating a basic fine structure body forming step that forms a basic fine structure body by pressing a fine structure mold against a curable resin (photocurable resin film) on a surface of a base material and a release and moving step that releases the fine structure mold from the base material and moves the fine structure mold, wherein the fine structure mold includes at least a first mold depression pattern which is disposed at center area of it, and a second mold depression pattern which is disposed in at least one side part in circumference area of it, and a size of the second mold depression pattern is smaller than a size of the first mold depression pattern.


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