The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Jul. 23, 2013
Applicant:
Mycartis NV, Zwijnaarde / Ghent, BE;
Inventors:
Raphael Tornay, Illarsaz, CH;
Nicolas Demierre, Chatel-St-Denis, CH;
Stephan Gamper, Lausanne, CH;
Philippe Renaud, Lausanne, CH;
Assignee:
MYCARTIS NV, Zwijnaarde/Ghent, BE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01N 33/53 (2006.01); B01L 3/00 (2006.01); G01N 33/543 (2006.01); C23F 1/02 (2006.01);
U.S. Cl.
CPC ...
G01N 33/5306 (2013.01); B01L 3/502707 (2013.01); B01L 3/502761 (2013.01); B01L 3/545 (2013.01); C23F 1/02 (2013.01); G01N 33/54373 (2013.01); B01L 2200/0647 (2013.01); B01L 2200/10 (2013.01); B01L 2200/12 (2013.01); B01L 2300/0803 (2013.01); B01L 2300/0819 (2013.01); B01L 2300/0893 (2013.01);
Abstract
The method according to the invention consists in providing a wafer having a bottom layer, a top first sacrificial layer and an insulating layer, structuring the first sacrificial layer to form a three dimensional structure onto which a first structural layer is deposited to define a corresponding three dimensional structure on the bottom surface of the first structural layer. The method consists also in forming a second three dimensional structure on the upper surface of the first structural layer.