The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 26, 2016
Filed:
Oct. 22, 2014
Elite Electronic Material (Zhong Shan) Co., Ltd., Zhongshan, Guangdong Province, CN;
Changyuan Li, Zhongshan, CN;
Chen-Yu Hsieh, Taiwan, CN;
Yalu Wang, Zhongshan, CN;
Zongyan Zhao, Zhongshan, CN;
Zhilong Hu, Zhongshan, CN;
Elite Electronic Material (Zhong Shan) Co., LTD., Zhongshan, CN;
Abstract
The present invention belongs to the technical field of a resin having low dielectric properties, and presents a vinylbenzyl-etherified-DOPO compound resin composition and a preparation method and application thereof. The composition includes a vinylbenzyl-etherified-DOPO compound resin and a vinyl-terminated polyphenylene ether resin. The DOPO resin is vinylbenzyl etherified in the present invention, thus obtaining a vinylbenzyl-etherified-DOPO compound resin having low dielectric properties, and there are no hydroxyl group on itself, no hydroxyl function group will be generated during the cross-linking reaction; and the vinylbenzyl-etherified-DOPO compound resin contains phosphorus atoms, and has flame retardancy. The prepared vinylbenzyl-etherified-DOPO compound resin and the hydroxyl-free, low dielectric vinyl-terminated polyphenylene ether resin are combined in the present invention, thus obtaining a resin composition having low dielectric constant and low dielectric loss tangent, which can achieve excellent dielectric properties and flame retardancy when applying to the metal laminates and printed circuit boards.