The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Aug. 29, 2013
Apparatus and methods using heat pipes for linking electronic assemblies that unequally produce heat
Eaton Corporation, Cleveland, OH (US);
George W. Oughton, Jr., Raleigh, NC (US);
George Arthur Navarro, Raleigh, NC (US);
Eaton Corporation, Cleveland, OH (US);
Abstract
An apparatus includes at least one heat sink and first and second electronic assemblies mounted on the at least one heat sink at respective first and second mounting sites and configured to unequally (e.g., at least partially non-concurrently) produce heat. At least one heat pipe is thermally coupled to the at least one heat sink and extends between locations proximate the first and second mounting sites. For example, the first and second electronic assemblies may be components of respective subsystems of an uninterruptible power supply (UPS), such as a rectifier and a battery converter, that generate heat in an at least partially non-concurrent manner.