The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Sep. 29, 2011
Applicants:

Jason A. Reese, Auburn, MI (US);

Samar R. Teli, Midland, MI (US);

James R. Keenihan, Midland, MI (US);

Joseph A. Langmaid, Caro, MI (US);

Kevin D. Maak, Midland, MI (US);

Michael E. Mills, Midland, MI (US);

Timothy C. Plum, Midland, MI (US);

Narayan Ramesh, Midland, MI (US);

Inventors:

Jason A. Reese, Auburn, MI (US);

Samar R. Teli, Midland, MI (US);

James R. Keenihan, Midland, MI (US);

Joseph A. Langmaid, Caro, MI (US);

Kevin D. Maak, Midland, MI (US);

Michael E. Mills, Midland, MI (US);

Timothy C. Plum, Midland, MI (US);

Narayan Ramesh, Midland, MI (US);

Assignee:

Dow Global Technologies LLC, Midland, MI (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H02N 6/00 (2006.01); H05K 7/00 (2006.01); H02S 30/10 (2014.01); H01R 13/52 (2006.01); H02S 40/34 (2014.01); H02S 20/25 (2014.01); H01R 9/22 (2006.01);
U.S. Cl.
CPC ...
H05K 7/00 (2013.01); H01R 13/5202 (2013.01); H02S 20/25 (2014.12); H02S 30/10 (2014.12); H02S 40/34 (2014.12); H01R 9/226 (2013.01); Y02B 10/12 (2013.01);
Abstract

The present invention is premised upon a connector and electronic circuit assembly () at least partially encased in a polymeric frame (). The assembly including at least: a connector housing (); at least one electrical connector (); at least one electronic circuit component (); and at least one barrier element ().


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