The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Aug. 08, 2014
Applicant:

Samsung Display Co., Ltd., Yongin, Gyeonggi-Do, KR;

Inventors:

Ki-Hae Shin, Mokpo-si, KR;

Jeong-Hun Go, Asan-si, KR;

Hee-Un Ku, Daejeon, KR;

Young-Sun Kim, Asan-si, KR;

Hoe-Seok Na, Gwangmyeong-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/02 (2006.01); H05K 3/36 (2006.01); H01L 23/498 (2006.01); H05K 1/18 (2006.01); H05K 3/28 (2006.01); H05K 3/32 (2006.01);
U.S. Cl.
CPC ...
H05K 1/028 (2013.01); H01L 23/4985 (2013.01); H05K 3/361 (2013.01); H05K 1/189 (2013.01); H05K 3/282 (2013.01); H05K 3/323 (2013.01); H05K 2201/053 (2013.01); H05K 2201/09154 (2013.01); H05K 2201/09227 (2013.01); H05K 2201/09254 (2013.01); H05K 2201/09727 (2013.01); H05K 2201/10128 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/1147 (2013.01);
Abstract

A tape package includes a base substrate including a signal transmitting area and a protruding area protruded from the signal transmitting area, an integrated circuit chip mounted on the base substrate, and a lead line disposed on the base substrate and including a first portion electrically connected with the integrated circuit chip, a second portion electrically connected with the first portion and extending in a first direction, and a third portion electrically connected with the second portion and extending in a second direction crossing the first direction.


Find Patent Forward Citations

Loading…