The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Mar. 27, 2014
Applicant:

Control Techniques Limited, Newtown, GB;

Inventors:
Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H05K 1/02 (2006.01); G06F 1/20 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H05K 1/0209 (2013.01); H05K 7/20909 (2013.01); H05K 1/0272 (2013.01); H05K 2201/09063 (2013.01); H05K 2201/09145 (2013.01); H05K 2203/081 (2013.01);
Abstract

There is described an electronic assembly comprising a structure and a printed circuit board (PCB) connected to the structure to form a duct. The PCB has a first side arranged to receive one or more heat-generating components, and a second side. The PCB comprises one or more apertures formed therein. The electronic assembly further comprises airflow generating means arranged to generate an airflow along the duct and along the second side of the PCB such that air is forced through the one or more apertures. By forming a duct beneath a PCB and allowing air to be forced through apertures formed in the PCB, more efficient cooling of components on the PCB may be achieved. For example, the position of the apertures may be tailored such that specific components, or specific parts of components, may be exposed to airflow through the apertures.


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