The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Mar. 11, 2015
Mitsubishi Electric Corporation, Tokyo, JP;
Kimio Shigihara, Tokyo, JP;
Kazushige Kawasaki, Tokyo, JP;
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Abstract
A method of manufacturing a semiconductor laser device includes the steps of: preparing the semiconductor laser bar body including a top surface, an undersurface, two mutually opposing facets, and two mutually opposing side faces, performing a coating step to form a coating film on the facet, and performing a division step after the coating step. The division step performs scribing on and divides the semiconductor laser bar body. A groove is formed on the facet by denting the facet, or is formed in the coating film by exposing a part of the facet, and the groove extends from the top surface to the undersurface. A width of the groove is 20 μm. Scribing is performed on the top surface or the undersurface so that a scribed track or an extended line of the scribed track meets the groove.