The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Feb. 23, 2015
Applicant:
Denso Corporation, Kariya, Aichi-pref., JP;
Inventors:
Yuuto Hirayama, Kariya, JP;
Tooru Taguchi, Handa, JP;
Assignee:
DENSO CORPORATION, Kariya, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/40 (2006.01); H01R 13/405 (2006.01); H01R 43/18 (2006.01); H01R 43/20 (2006.01); H01R 13/52 (2006.01); G01L 19/00 (2006.01); H01R 13/533 (2006.01);
U.S. Cl.
CPC ...
H01R 13/405 (2013.01); G01L 19/0084 (2013.01); H01R 13/5202 (2013.01); H01R 13/5216 (2013.01); H01R 43/18 (2013.01); H01R 43/20 (2013.01); H01R 13/533 (2013.01); Y10T 29/4922 (2015.01);
Abstract
A liquid adhesive sealant for bonding a connector case and a terminal holder is filled in a sealant filled chamber formed in a space surrounded by a first fitting peripheral wall and a bottom surface of a first groove of the connector case made of a primary molding resin, and a second fitting peripheral wall and a bottom surface of a second groove of the terminal holder made of the primary molding resin in an electrical connector.