The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Nov. 04, 2011
Applicants:

Yuusuke Kondou, Chikusei, JP;

Etsuo Mizushima, Chikusei, JP;

Yasushi Watanabe, Chikusei, JP;

Yasuyuki Mizuno, Chikusei, JP;

Inventors:

Yuusuke Kondou, Chikusei, JP;

Etsuo Mizushima, Chikusei, JP;

Yasushi Watanabe, Chikusei, JP;

Yasuyuki Mizuno, Chikusei, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01P 1/06 (2006.01); H01P 5/00 (2006.01); H01P 5/18 (2006.01); H01P 5/02 (2006.01); H01P 11/00 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01P 5/00 (2013.01); H01P 5/028 (2013.01); H01P 5/185 (2013.01); H01P 11/001 (2013.01); H05K 1/024 (2013.01); H05K 2201/0959 (2013.01); Y10T 29/49016 (2015.01);
Abstract

This electromagnetic coupling structure includes a laminated body that is laminated with an inner dielectric layer interposed between inner conductive layers, one pair of outer dielectric layers facing each other with the laminated body interposed therebetween, and one pair of outer conductive layers facing each other with the one pair of outer dielectric layers interposed therebetween. The one pair of outer conductive layers include wiring portions and conductive patch portions disposed at front ends of the wiring portions, and the conductive patch portions have portions longer than the wiring portions in a direction perpendicular to an extending direction of the wiring portions. In the laminated body, a hole passing through the inner dielectric layer and the inner conductive layers is arranged, and the one pair of outer conductive layers are electromagnetically coupled through a metal film formed inside the hole.


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