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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9397279 B1

PDFFull Text
Date of Patent:
Jul. 19, 2016

Filed:

May. 27, 2014

Electric conductive heat dissipation substrate

Applicant:

Industrial Technology Research Institute, Hsinchu, TW;

Inventors:

Cheng-Chuan Wang, Changhua County, TW;

Cheng-Chou Wong, Hsinchu County, TW;

Chia-Ying Yen, Changhua County, TW;

Hsin-Hwa Chen, New Taipei, TW;

Assignee:

Industrial Technology Research Institute, Hsinchu, TW;

Attorney:

Jianq Chyun IP Office

Primary Examiner:

Michael E La Villa

Int. Cl.
CPC ...
H01L 33/64 (2010.01); B32B 15/04 (2006.01); B32B 18/00 (2006.01); C23C 28/00 (2006.01); C23C 30/00 (2006.01); H01L 23/00 (2006.01); H05K 1/02 (2006.01); H05K 1/03 (2006.01); H05K 3/18 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 33/641 (2013.01); C23C 28/00 (2013.01); C23C 28/30 (2013.01); C23C 28/32 (2013.01); C23C 28/321 (2013.01); C23C 28/322 (2013.01); C23C 28/324 (2013.01); C23C 28/34 (2013.01); C23C 30/00 (2013.01); C23C 30/005 (2013.01); H01L 23/00 (2013.01); H05K 1/0271 (2013.01); H05K 1/0306 (2013.01); H05K 3/185 (2013.01); H05K 3/188 (2013.01); H01L 33/62 (2013.01); H01L 2924/0002 (2013.01); H05K 2203/072 (2013.01); H05K 2203/0709 (2013.01); H05K 2203/0723 (2013.01); Y10T 428/1291 (2015.01); Y10T 428/12576 (2015.01); Y10T 428/12611 (2015.01); Y10T 428/12618 (2015.01); Y10T 428/12882 (2015.01); Y10T 428/12889 (2015.01); Y10T 428/12896 (2015.01); Y10T 428/12903 (2015.01); Y10T 428/12931 (2015.01); Y10T 428/12944 (2015.01); Y10T 428/2495 (2015.01); Y10T 428/24959 (2015.01); Y10T 428/24967 (2015.01); Y10T 428/24975 (2015.01); Y10T 428/263 (2015.01); Y10T 428/264 (2015.01); Y10T 428/265 (2015.01);
Abstract

An electric conduction heat dissipation substrate includes a ceramic substrate, and a seed layer, and a buffering material layer and a copper circuit layer formed thereon in order. The buffering material layer has a coefficient of thermal expansion between those of the ceramic substrate and the copper circuit layer. Moreover, the buffering material layer is composed of alloy material and ceramic material or composed of metal material and ceramic material.

Find Patent Forward Citations

Wang, Cheng-Chuan. (2016). Electric conductive heat dissipation substrate (U.S. Patent No. 9397279). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9397279

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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