The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Apr. 20, 2009
Applicants:

Harald Jaeger, Regensburg, DE;

Joerg Erich Sorg, Regensburg, DE;

Tsutomu Kashiwagi, Annaka, JP;

Toshio Shiobara, Annaka, JP;

Inventors:

Harald Jaeger, Regensburg, DE;

Joerg Erich Sorg, Regensburg, DE;

Tsutomu Kashiwagi, Annaka, JP;

Toshio Shiobara, Annaka, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 33/48 (2010.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H05K 1/0366 (2013.01); H01L 2224/48091 (2013.01); H01L 2924/12044 (2013.01); H05K 2201/0162 (2013.01);
Abstract

An optoelectronic semiconductor component includes a connection carrier with at least two connection points and a carrier top that in a main side of the connection carrier, wherein the connection carrier configured with a silicone matrix with a fiber reinforcement, at least one optoelectronic semiconductor chip mounted on the connection carrier and in direct contact therewith, an annular potting body includes a soft silicone on the carrier top and in direct contact with the carrier top, but not in direct contact with the semiconductor chip, and a glass body comprising a glass sheet applied over the semiconductor chip and over sides of the potting body remote from the connection carrier, thereby forming a space between the semiconductor chip and the potting body.


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