The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Feb. 24, 2015
Applicant:

Seoul Viosys Co., Ltd., Ansan-si, KR;

Inventors:

Ye Seul Kim, Ansan-si, KR;

Kyoung Wan Kim, Ansan-si, KR;

Yeo Jin Yoon, Ansan-si, KR;

Sang Hyun Oh, Ansan-si, KR;

Keum Ju Lee, Ansan-si, KR;

Jin Woong Lee, Ansan-si, KR;

Da Yeon Jeong, Ansan-si, KR;

Sang Won Woo, Ansan-si, KR;

Assignee:

SEOUL VIOSYS CO., LTD., Ansan-Si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/38 (2010.01); H01L 33/10 (2010.01); H01L 33/40 (2010.01); H01L 33/44 (2010.01); H01L 33/60 (2010.01); H01L 33/36 (2010.01); H01L 33/42 (2010.01); H01L 33/46 (2010.01); H01L 33/00 (2010.01); H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 33/387 (2013.01); H01L 33/0008 (2013.01); H01L 33/10 (2013.01); H01L 33/36 (2013.01); H01L 33/38 (2013.01); H01L 33/382 (2013.01); H01L 33/385 (2013.01); H01L 33/40 (2013.01); H01L 33/405 (2013.01); H01L 33/42 (2013.01); H01L 33/44 (2013.01); H01L 33/46 (2013.01); H01L 33/60 (2013.01); H01L 33/20 (2013.01); H01L 2933/0016 (2013.01); H01L 2933/0066 (2013.01);
Abstract

Disclosed herein in an LED chip including electrode pads. The LED chip includes a semiconductor stack including a first conductive type semiconductor layer, a second conductive type semiconductor layer on the first conductive type semiconductor layer, and an active layer interposed between the first conductive type semiconductor layer and the second conductive type semiconductor layer, a first electrode pad located on the second conductive type semiconductor layer opposite to the second conductive type semiconductor layer; a first electrode extension extending from the first electrode pad and connected to the first conductive type semiconductor layer; a second electrode pad electrically connected to the second conductive type semiconductor layer; and an insulation layer interposed between the first electrode pad and the second conductive type semiconductor layer. The LED chip includes the first electrode pad on the second conductive type semiconductor layer, thereby increasing a light emitting area.


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