The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Dec. 20, 2013
Applicant:

Integrated Device Technology, Inc., San Jose, CA (US);

Inventors:

Kenneth L. Astrof, Edmonds, WA (US);

Robert A. Gubser, Arlington, WA (US);

Ajay Kumar Ghai, San Jose, CA (US);

Viresh Piyush Patel, Austin, TX (US);

Jitesh Shah, Fremont, CA (US);

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01);
U.S. Cl.
CPC ...
H01L 28/10 (2013.01);
Abstract

A packaged integrated circuit includes an integrated circuit substrate and a cap bonded to a surface of the integrated circuit substrate. The cap has a recess therein that is at least partially lined with at least one segment of an inductor. This inductor may be electrically coupled to an electrical component within the integrated circuit substrate. In some embodiments, the inductor is patterned to extend along a sidewall and interior top surface of the recess, which extends opposite the integrated circuit substrate. The inductor may include a plurality of arcuate-shaped segments and may be patterned to be symmetric about a center-tapped portion thereof. The cap may also include a magnetic material therein that increases an effective inductance of the inductor relative to an otherwise equivalent cap and inductor combination that is devoid of the magnetic material.


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