The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Feb. 03, 2010
Applicant:

Hiroharu Shimizu, Kanagawa, JP;

Inventor:

Hiroharu Shimizu, Kanagawa, JP;

Assignee:

RENESAS ELECTRONICS CORPORATION, Kawasaki-Shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 27/02 (2006.01); H01L 27/118 (2006.01); H01L 31/075 (2012.01); H01L 31/0392 (2006.01); H01L 27/144 (2006.01); H01L 27/092 (2006.01);
U.S. Cl.
CPC ...
H01L 27/0207 (2013.01); H01L 27/11803 (2013.01); H01L 27/092 (2013.01); H01L 27/1446 (2013.01); H01L 31/03926 (2013.01); H01L 31/075 (2013.01); H01L 2027/11861 (2013.01); H01L 2027/11881 (2013.01);
Abstract

There is provided a technique capable of reducing a layout area of a standard cell configuring a digital circuit even under a circumstance that a new layout rule introduced in accordance with microfabrication of a MISFET is provided. For example, a protruding wiring PLA protrudes from a power supply wiring LA at each corner of both ends of a standard cell CL toward an inside of the standard cell CL (in a Y direction), and a bent portion BDA which is bent from the protruding wiring PLA in an X direction is formed. And, this bent portion BDA and a p-type semiconductor region PDR are connected to each other via a plug PLG.


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