The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Jan. 07, 2016
Applicants:

William E. Edwards, Ann Arbor, MI (US);

Gary C. Johnson, Tempe, AZ (US);

Inventors:

William E. Edwards, Ann Arbor, MI (US);

Gary C. Johnson, Tempe, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 25/50 (2013.01); H01L 21/4825 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01);
Abstract

First and second semiconductor die are mounted to first and second die pads of a lead frame disposed in a lead frame sheet. With a plurality of wire bonds, each post of a plurality of posts of the lead frame is connected to the first and second semiconductor die. Each post extends inward from opposite sides of the lead frame between the first and second die pads and is connected with a respective one of a plurality of leads of the lead frame. The first and second semiconductor die, the plurality of posts of the lead frame, and the plurality of wire bonds are encapsulated in a package. The lead frame sheet is sheared to define each lead of the plurality of leads. The plurality of posts includes first and second sets of posts extending inward from first and second opposite sides of the lead frame.


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