The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9397057 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 19, 2016

Filed:

May. 28, 2015
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Yutaka Onozuka, Yokohama, JP;

Hiroshi Yamada, Yokohama, JP;

Nobuto Managaki, Kawasaki, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/768 (2006.01); H01L 23/31 (2006.01); H01L 23/522 (2006.01); H01L 23/04 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/538 (2006.01); H01L 23/532 (2006.01);
U.S. Cl.
CPC ...
H01L 24/08 (2013.01); H01L 21/76802 (2013.01); H01L 23/04 (2013.01); H01L 23/3128 (2013.01); H01L 23/3157 (2013.01); H01L 23/481 (2013.01); H01L 23/49816 (2013.01); H01L 23/49894 (2013.01); H01L 23/5226 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5389 (2013.01); H01L 24/19 (2013.01); H01L 24/96 (2013.01); H01L 23/5329 (2013.01); H01L 2224/0401 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/05025 (2013.01); H01L 2224/05083 (2013.01); H01L 2224/05144 (2013.01); H01L 2224/05155 (2013.01); H01L 2224/05166 (2013.01); H01L 2224/12105 (2013.01); H01L 2224/24137 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/07025 (2013.01); H01L 2924/12 (2013.01);
Abstract

According to an embodiment, a semiconductor device comprises an insulative resin, an interconnect, a plurality of semiconductor elements, a first conductive unit, a first connector, and a first metal layer. The insulative resin includes a first region and a second region. At least a portion of the interconnect is arranged with at least a portion of the first region in a first direction. The first conductive unit pierces the second region in the first direction. At least a portion of the first connector is arranged with at least a portion of the first conductive unit in the first direction. At least a portion of the first connector is arranged with at least a portion of the interconnect in a second direction intersecting the first direction. The first metal layer is provided between the first conductive unit and the first connector. The first metal layer contacts the insulative resin.


Find Patent Forward Citations

Onozuka, Yutaka. (2016). Plurality of semiconductor devices in resin with a via (U.S. Patent No. 9397057). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9397057

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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