The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Sep. 06, 2013
Applicant:

Mediatek Singapore Pte. Ltd., Singapore, SG;

Inventors:

Chiyuan Lu, San Jose, CA (US);

Chien-Chih Lin, Hsinchu, TW;

Cheng-Chou Hung, Hukou Township, Hsinchu County, TW;

Yu-Hua Huang, Hsinchu, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/768 (2006.01); H01L 23/58 (2006.01); H01L 27/08 (2006.01); H01L 29/872 (2006.01);
U.S. Cl.
CPC ...
H01L 23/498 (2013.01); H01L 21/76802 (2013.01); H01L 23/585 (2013.01); H01L 27/0814 (2013.01); H01L 29/872 (2013.01); H01L 2924/00 (2013.01); H01L 2924/0002 (2013.01);
Abstract

A guard ring structure is provided, including a semiconductor substrate with a circuit region encircled by a first ring and a second ring. In one embodiment, the semiconductor substrate has a first dopant type, and the first and second ring respectively includes a plurality of separated first doping regions formed in a top portion of the semiconductor substrate, having a second dopant type opposite to the first conductivity type, and an interconnect element formed over the semiconductor substrate, covering the first doping regions.


Find Patent Forward Citations

Loading…