The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

May. 03, 2013
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Naveen Tipirneni, Plano, TX (US);

Sameer Pendharkar, Allen, TX (US);

Rick L. Wise, Fairview, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/34 (2006.01); H01L 21/18 (2006.01); H01L 21/762 (2006.01); H01L 21/8258 (2006.01);
U.S. Cl.
CPC ...
H01L 21/187 (2013.01); H01L 21/76254 (2013.01); H01L 21/8258 (2013.01);
Abstract

An integrated silicon and III-N semiconductor device may be formed by growing III-N semiconductor material on a first silicon substrate having a first orientation. A second silicon substrate with a second, different, orientation has a release layer between a silicon device film and a carrier wafer. The silicon device film is attached to the III-N semiconductor material while the silicon device film is connected to the carrier wafer through the release layer. The carrier wafer is subsequently removed from the silicon device film. A first plurality of components is formed in and/or on the silicon device film. A second plurality of components is formed in and/or on III-N semiconductor material in the exposed region. In an alternate process, a dielectric interlayer may be disposed between the silicon device film and the III-N semiconductor material in the integrated silicon and III-N semiconductor device.


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