The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Aug. 25, 2011
Applicants:
David B. Kerwin, Colorado Springs, CO (US);
Joseph M. Benedetto, Monument, CO (US);
Inventors:
David B. Kerwin, Colorado Springs, CO (US);
Joseph M. Benedetto, Monument, CO (US);
Assignee:
Aeroflex Colorado Springs Inc., Colorado Springs, CO (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/66 (2006.01); H01L 21/20 (2006.01); H01L 21/18 (2006.01); H01L 27/092 (2006.01); H01L 29/10 (2006.01);
U.S. Cl.
CPC ...
H01L 21/187 (2013.01); H01L 27/0921 (2013.01); H01L 29/1087 (2013.01);
Abstract
A bonded wafer structure having a handle wafer, a device wafer, and an interface region with an abrupt transition between the conductivity profile of the device wafer and the handle wafer is used for making semiconductor devices. The improved doping profile of the bonded wafer structure is well suited for use in the manufacture of integrated circuits. The bonded wafer structure is especially suited for making radiation-hardened integrated circuits.