The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Oct. 28, 2015
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Won-Jae Joo, Seongnam-si, KR;

Sungwoo Hwang, Seoul, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 27/06 (2006.01); H01L 27/12 (2006.01); H01L 23/538 (2006.01); H01L 21/311 (2006.01); H01L 29/16 (2006.01); H01L 29/786 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02532 (2013.01); H01L 21/0245 (2013.01); H01L 21/0262 (2013.01); H01L 21/02381 (2013.01); H01L 21/02444 (2013.01); H01L 21/02513 (2013.01); H01L 21/02592 (2013.01); H01L 21/02667 (2013.01); H01L 21/02694 (2013.01); H01L 21/31122 (2013.01); H01L 23/5387 (2013.01); H01L 27/0688 (2013.01); H01L 27/1203 (2013.01); H01L 29/1606 (2013.01); H01L 29/78684 (2013.01);
Abstract

Provided are methods of manufacturing an ultra-thin inorganic semiconductor film and methods of manufacturing three-dimensional (3D) semiconductor device using the ultra-thin inorganic semiconductor film. A method of manufacturing the ultra-thin inorganic semiconductor film includes preparing a Ge substrate, forming an amorphous graphene layer on the Ge substrate, forming an ultra-thin inorganic semiconductor film on the amorphous graphene layer, and transferring the ultra-thin inorganic semiconductor film to a target substrate. The ultra-thin inorganic semiconductor film is a Si thin film or a Ge thin film and may have a thickness of 50 μm or less.


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Joo, Won-Jae. (2016). Method of fabricating ultra-thin inorganic semiconductor film and method of fabricating three-dimensional semiconductor device using the same (U.S. Patent No. 9396935). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9396935

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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