The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Jul. 15, 2014
Murata Manufacturing Co., Ltd., Nagaokakyo-shi, Kyoto-Fu, JP;
Toshiki Nagamoto, Nagaokakyo, JP;
MURATA MANUFACUTRING CO., LTD., Nagaokakyo-Shi, Kyoto-Fu, JP;
Abstract
An electroconductive paste that includes an inorganic filler which contains a spherical Cu powder of 3 μm or less in average particle size; a flat Cu powder of 3 or more in aspect ratio and 10 μm or more in average particle size; glass frit; and a spherical inorganic powder of 30 μm or more in average particle size, the spherical inorganic powder including an inorganic material that is not melted in a heat treatment step for baking. The spherical inorganic powder is contained in a proportion of 10 to 35 parts by volume with respect to 100 parts by volume of a mixture of the spherical Cu powder and the flat Cu powder. In addition, the proportion of the flat Cu powder falls within the range of 10 to 50% by volume with respect to the total amount of the spherical Cu powder and flat Cu powder.