The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Oct. 16, 2014
Applicant:
SK Hynix Inc., Icheon-si, Gyeonggi-do, KR;
Inventors:
Min Su Park, Icheon-si, KR;
Young Jun Ku, Icheon-si, KR;
Assignee:
SK hynix Inc., Icheon-si, Gyeonggi-do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/088 (2006.01); G11C 5/02 (2006.01); G11C 29/04 (2006.01); G11C 5/04 (2006.01); G11C 29/46 (2006.01);
U.S. Cl.
CPC ...
G11C 5/025 (2013.01); G11C 5/04 (2013.01); G11C 29/04 (2013.01); G11C 29/46 (2013.01);
Abstract
A stacked semiconductor package includes a package substrate, an interposer mounted on the package substrate, a plurality of semiconductor chips stacked on the interposer, and a control unit provided in the interposer, that stores in advance data to be written in the plurality of semiconductor chips, and that outputs the data stored in advance according a test mode signal.