The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Jul. 03, 2014
Applicant:

Shenzhen China Star Optoelectronics Technology Co., Ltd., Shenzhen, Guangdong, CN;

Inventors:

Dehua Li, Guangdong, CN;

Yu-chun Hsiao, Guangdong, CN;

Shih Hsiang Chen, Guangdong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1335 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
G02F 1/133603 (2013.01); G02F 1/133615 (2013.01); H05K 1/0203 (2013.01); G02F 2001/133612 (2013.01); G02F 2001/133628 (2013.01);
Abstract

A backlight assembly and an LCD using the same are provided. The backlight assembly comprises: a light source, a conductive copper layer, a dielectric layer, a metallic printed circuit board and a heat sink. The dielectric layer is attached to one side surface of the metallic printed circuit board. The conductive copper layer is mounted on the dielectric layer. The light source and the heat sink are respectively connected to the conductive copper layer. The light source utilizes the conductive copper layer to conduct electricity and to conduct the heat to the heat sink. The backlight assembly has the heat sink connecting to the light source through the conductive copper layer to shorten the heat dissipating path of the light source and to enhance the heat-dissipating efficiency of the light source. Moreover, for the narrow frame, the heat sink is directly welded to the bent metallic printed circuit board.


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