The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Jun. 23, 2014
Applicant:
Hon Hai Precision Industry Co., Ltd., New Taipei, TW;
Inventor:
Wei-Chih Lin, New Taipei, TW;
Assignee:
HON HAI PRECISION INDUSTRY CO., LTD., New Taipei, TW;
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/28 (2006.01); G01R 1/04 (2006.01);
U.S. Cl.
CPC ...
G01R 31/2863 (2013.01); G01R 1/0458 (2013.01); G01R 1/0466 (2013.01);
Abstract
An burn-in socket electrically connecting an IC package to a PCB, has a base, a cover, a plurality of contacts and a block-shaped heat sink. The base defines a receiving space for the IC package. The cover is pin-jointed to one side by a pivot of the base and able to rotate around the pivot. A plurality of contacts are retained in the base and partially exposed in the receiving space. The heat sink is located above the IC package and against to the IC package so as to apply its gravity force to the IC package. A top face of the heat sink is below the top face of the cover.