The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Feb. 09, 2015
Applicant:

Trane International Inc., Piscataway, NJ (US);

Inventor:

Roger J. Voorhis, Clarksville, TN (US);

Assignee:

TRANE INTERNATIONAL INC., Davidson, NC (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
F25B 5/00 (2006.01); F25B 5/02 (2006.01); F25B 13/00 (2006.01); F25B 31/00 (2006.01); F25B 30/06 (2006.01); F25B 41/04 (2006.01);
U.S. Cl.
CPC ...
F25B 5/02 (2013.01); F25B 13/00 (2013.01); F25B 30/06 (2013.01); F25B 31/006 (2013.01); F25B 41/04 (2013.01); F25B 2313/021 (2013.01); F25B 2313/02741 (2013.01); F25B 2400/077 (2013.01);
Abstract

A system and method for cooling power electronics using heat sinks, and including a heat pump. The heat pump includes a main refrigerant circuit having a compressor, an indoor heat exchanger, and an outdoor heat exchanger, and a reversing valve. A biflow expansion valve is configured to receive condensed liquid refrigerant and to expand the refrigerant. A cooling circuit in fluid communication with the main refrigerant line includes an expansion device configured to receive a portion of condensed liquid refrigerant from the main refrigerant circuit and to expand the portion of condensed liquid refrigerant. A heat sink is configured to receive the expanded portion of refrigerant from the expansion device. Power electronics are coupled to the heat sink such that the portion of expanded refrigerant from the expansion device passes through the heat sink and cools the power electronics.


Find Patent Forward Citations

Voorhis, Roger. (2016). System and method for cooling power electronics using heat sinks (U.S. Patent No. 9395106). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/9395106

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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