The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 19, 2016
Filed:
Apr. 09, 2009
Applicants:
Audrey A. Sherman, St. Paul, MN (US);
Jayshree Seth, Woodbury, MN (US);
Wendi J. Winkler, Minnespolis, MN (US);
Inventors:
Audrey A. Sherman, St. Paul, MN (US);
Jayshree Seth, Woodbury, MN (US);
Wendi J. Winkler, Minnespolis, MN (US);
Assignee:
3M Innovative Properties Company, St. Paul, MN (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 7/02 (2006.01);
U.S. Cl.
CPC ...
C09J 7/0207 (2013.01); C09J 2201/28 (2013.01); Y10T 156/10 (2015.01); Y10T 428/24612 (2015.01);
Abstract
Methods of making cut adhesive articles are described. The methods involve: providing a crosslinked pressure sensitive adhesive layer disposed on a substrate, embossing a surface of the crosslinked pressure sensitive adhesive layer to form a microstructured crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface, and die cutting the microstructured crosslinked pressure sensitive adhesive layer.