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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9394439 B1

PDFFull Text
Date of Patent:
Jul. 19, 2016

Filed:

Mar. 14, 2013

Resin composition, prepreg, resin sheet, and metal foil-clad laminate

Applicant:

Mitsubishi Gas Chemical Company, Inc., Tokyo, JP;

Inventors:

Syouichi Itoh, Tokyo, JP;

Emi Fukasawa, Tokyo, JP;

Yoshitaka Ueno, Tokyo, JP;

Michio Yaginuma, Tokyo, JP;

Assignee:

MITSUBISHI GAS CHEMICAL COMPANY, INC., Tokyo, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Michael J Feely

Int. Cl.
CPC ...
B32B 15/08 (2006.01); B32B 15/082 (2006.01); B32B 15/092 (2006.01); B32B 27/04 (2006.01); B32B 27/18 (2006.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 27/38 (2006.01); C08L 63/00 (2006.01); C08L 71/12 (2006.01); C08J 5/24 (2006.01); B32B 15/14 (2006.01); H05K 1/03 (2006.01); H05K 1/05 (2006.01); H05K 3/44 (2006.01); C08K 5/5313 (2006.01); C08K 5/5399 (2006.01); C08K 5/315 (2006.01);
U.S. Cl.
CPC ...
C08L 71/126 (2013.01); B32B 15/08 (2013.01); B32B 15/14 (2013.01); C08J 5/24 (2013.01); C08L 63/00 (2013.01); C08L 71/12 (2013.01); H05K 1/0353 (2013.01); H05K 1/056 (2013.01); H05K 3/44 (2013.01); B32B 2260/046 (2013.01); B32B 2305/076 (2013.01); C08J 2371/12 (2013.01); C08J 2425/06 (2013.01); C08J 2463/04 (2013.01); C08J 2475/00 (2013.01); C08J 2485/02 (2013.01); C08K 5/315 (2013.01); C08K 5/5313 (2013.01); C08K 5/5399 (2013.01); C08L 2201/02 (2013.01); C08L 2203/206 (2013.01); C08L 2205/035 (2013.01); H05K 1/0366 (2013.01); H05K 2201/0209 (2013.01); H05K 2203/06 (2013.01); Y10T 156/10 (2015.01); Y10T 428/31511 (2015.04); Y10T 428/31522 (2015.04); Y10T 428/31529 (2015.04);
Abstract

A resin composition has high flame retardancy and excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and single-layer or laminated sheet, a metal foil-clad laminate using the prepreg, and the like. The resin composition has polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components. wherein m represents an integer of 1 to 3.

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