The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 19, 2016

Filed:

Mar. 15, 2013
Applicant:

Bell Helicopter Textron Inc., Fort Worth, TX (US);

Inventors:

Kenneth Myron Jackson, Euless, TX (US);

Walter West Riley, Richardson, TX (US);

Assignee:

Bell Helicopter Textron Inc., Fort Worth, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B64F 5/00 (2006.01); B64C 27/00 (2006.01); B32B 15/01 (2006.01); C23C 24/04 (2006.01); B64D 33/00 (2006.01); B64D 45/00 (2006.01);
U.S. Cl.
CPC ...
B64F 5/0081 (2013.01); B32B 15/011 (2013.01); B32B 15/013 (2013.01); B64C 27/006 (2013.01); B64D 33/00 (2013.01); C23C 24/04 (2013.01); B64D 2045/009 (2013.01); F05D 2230/31 (2013.01); Y10T 29/49318 (2015.01); Y10T 29/49746 (2015.01); Y10T 428/12063 (2015.01);
Abstract

A method of repairing a component comprises identifying a non-compliant surface of the component, wherein the non-compliant surface is not within an allowable tolerance, cold spraying a powder comprising a metal onto the non-compliant surface, and forming a coating comprising the metal over the non-compliant surface, wherein an outer surface of the coating is within an allowable tolerance. In an embodiment, the method of repairing an outer component further comprises machining the outer surface of the coating. In an embodiment, the component is a shaft, a rotor mast, an input quill, or a bearing. In an embodiment, the component contains electronic equipment during the cold spraying, and wherein the cold spraying does not damage the electronic equipment. In an embodiment, the component is repaired without subjecting the component to a hydrogen embrittlement bake.


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